Date: Oct. 23-25, 2021

Venue: Huizhou, Guangdong, China

Website: http://edgence.org/DATACOM2021/

Submission Link: https://easychair.org/conferences/?conf=datacom2021

 

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★ABOUT IEEE DataCom 2021

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Big data is a rapidly expanding research area spanning the fields of computer science and information management, and has become a ubiquitous term in understanding and solving complex problems in different disciplinary fields such as engineering, applied mathematics, medicine, computational biology, healthcare, social networks, finance, business, government, education, transportation and telecommunications.

 

The goal of the IEEE 2021 International Conference on Big Data Intelligence and Computing (IEEE DataCom 2021) is to establish an international forum for engineers and scientists to present their ideas and experiences in the fields of Big Data intelligence and computing. IEEE DataCom 2021 welcomes paper submissions on innovative work from researchers in academia, industry and government describing original research work in Big Data.

 

IEEE DataCom 2021 will be held on October 23-25, 2021, co-located with IEEE SAGC 2021 in Huizhou, Guangdong, China. 

 

★Sponsors

-IEEE

-IEEE Computer Society

-IEEE Cloud Computing

 

★Organizers

-Huizhou University

-Beijing University of Posts and Telecommunications

 

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★CALL FOR PAPERS

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*Topics of interest include, but are not limited to:

-The 5Vs of the data landscape: volume, variety, velocity, veracity, value

-Big data science and foundations

-Analytics, visualization and semantics

-Software and tools for big data management.

-Security, privacy and legal issues specific to big data

-Big data economy, QoS and business models

-Scientific discovery and business intelligence

-Software, hardware and algorithm co-design

-High-performance computing

-Large-scale recommendation systems 

-Graph analysis

-Infrastructures and systems for big data analytics and managements

-Middleware and tools for big data analytics and managements

-Algorithmic, experimental, prototyping and implementation

-Data quality issues: such as validation, metrics, optimizations and consistency

-Data-driven innovation, computational modelling and data integration

-Data intensive computing theorems and technologies

-Big data for advanced manufacturing and productivity

-Modeling, simulation and performance evaluation

-Green data centers / environmental-friendly perspectives

-Computing, scheduling and resource management for sustainability

-Complex applications in areas where massive data is generated

 

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★PUBLICATION HIGHLIGHTS

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IEEE CS proceedings, indexed by 

-IEEE Xplore

-Scopus

-EI Engineering Index

-ACM Digital Library

-dblp

-Google Scholar

*Extended version of the selected papers will be invited for publication in prestigious international journals.

 

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★SUBMISSION 

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Authors are invited to submit their original research work that has not previously been submitted or published in any other venue. Papers should be prepared in IEEE CS format and submitted via the IEEE DataCom 2021 website, https://easychair.org/conferences/?conf=datacom2021

 

IEEE formatting information:

http://www.ieee.org/conferences_events/conferences/publishing/templates.html

 

- Proposals for organizing tutorials, workshops and special sessions need to be submitted to the Workshops Chair of the conference. A proposal should include title, theme, scope and main presenters/organizers.

- Research paper (8 pages) should explore a specific technology problem and propose a complete solution to it, with experimental results. 

- Works-in-Progess (WIP) (6 pages) papers are expected to present either work currently in progress or less developed but highly innovative ideas. 

- Demo/Poster papers (4 pages) must describe working systems and be related to DataCom. These systems may be innovative prototype implementations or mature systems that use related technology.  Papers/proposals need to be submitted to the Demo/Poster Chair.

- Workshop and Special Session papers need to be submitted to the corresponding workshops and special sessions Chairs. 

 

*All accepted papers in the main tracks, workshops, special sessions and demos/posters will be published in an IEEE Computer Society proceedings. Extended versions of selected excellent papers will be considered for publication in special issues of prestige journals (SCI/EI indexed).

 

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★BEST PAPER AWARDS

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The award committee will select Best Paper/Poster Award(s) and present the winners with an actual frame Award Certificate at the conference banquet.

 

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★ORGANIZING COMMITTEES

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=General Chairs=

Shangguang Wang, Beijing University of Posts and Telecommunications, China

Jack Dongarra, Univ of Tennessee, USA

 

=Program Chairs=

Ao Zhou, Beijing University of Posts and Telecommunications, China

Hui Lei, IBM T. J. Watson Research Center, USA

 

=Workshop Chairs=

Mengwei Xu, Beijing University of Posts and Telecommunications, China

 

=Demo/Poster Chair=

Xiao Ma, Beijing University of Posts and Telecommunications, China

 

=Award Chair=

Lingyan Zhang, Central South University, China

 

=Publicity Chair=

Sotiris Moschoyiannis, University of Surrey, UK

Bahman Javadi, University of Western Sydney, Australia

 

=Local Chair=

Lu Chen, Huizhou University, China

Zhen Wang, Huizhou University, China

Huabin Wang, Huizhou University, China

Tao Xu, Huizhou University, China

Xiaohuan Zhang, Huizhou University, China

Haiyang Yu, Huizhou University, China

 

=Advisory Committee=

Anna Kobusinska, Poznan University of Technology, Poland

Beniamino Di Martino, Second University of Naples, Italy

Christophe Cérin, Université Paris 13, France

Cho-Li Wang, The University of HongKong, Hong Kong

Song Guo, The Hong Kong Polytechnic University, Hong Kong

Wenguang Chen, Tsinghua University, China

Xiaolin Li, University of Florida, USA

Yeh-Ching Chung, The Chinese University of HongKong, Hong Kong

 

=Steering Committee=

Sanjay Ranka, University of Florida, USA

Robert Hsu, National Chung Cheng University, Taiwan

Manish Parashar, Rutgers University, USA

Hai Jin, HUST, China

Jie Li, University of Tsukuba, Japan

Yuanyuan Yang, Stony Brook University, USA

 

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★CONTACT US

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Tel: (+86) 28 87 555 888

Mob: (+86) 132 8128 0917

Email: [email protected]