★Full Name: International Symposium of EDA 2024

★Abbreviation: ISEDA 2024

 

Date: May 10-13, 2024

Website: https://www.eda2.com/iseda/

Venue: Xi'an, China

 

Jointly organized by EDA² and EDA Committee of CIE, the ISEDA (International Symposium of EDA) is an annual premier forum dedicated to VLSI design automation. The symposium aims at exploring the new challenges, presenting leading-edge technologies and providing EDA community with opportunities of predicting future directions in EDA research areas. ISEDA covers the full range of EDA topics from device and circuit levels up to system level, from analog to digital designs as well as manufacturing. The format of meeting intends to cultivate productive and novel interchangeable ideas among EDA researcher and developers. Academic and industrial EDA related professionals who are interested in EDA's theoretical and practical research are all welcomed to contribute to ISEDA.

 

★Advisors

IEEE/CEDA, ACM/SIGDA

Department of Information Science, National Natural Science Foundation of China (NSFC)

Chinese Institute of Electronics (CIE)

Steering Committee, Major Plan of “Fundamental Research on Post-Moore Novel Devices”

 

★Organizer

EDA Ecosystem Development Accelerator (EDA²)

EDA Committee of CIE

 

★Co-Organizers

Xidian University

Peking University

Southeast University

Tsinghua University

 

★Committees

-Executive Committee-

General Chairs：

Ru Huang，President of Southeast University & Academician of the Chinese Academy of Sciences

Yue Hao，Professor of Xidian University & Academician of the Chinese Academy of Sciences

 

-Steering Committee-

Shaojun Wei, Tsinghua University

Xuan Zeng, Fudan University

Patrick Girard, French National Center for Scientific Research

 

-Technical Program Committee-

Conference Chairs：

Zhangming Zhu, Xidian University

Runsheng Wang, Peking University

Jun Yang, Southeast University

 

Technical Program Chairs：

Hailong You, Xidian University

Yun Liang, Peking University

Hao Yan, Southeast University

 

Special Session Chair:

Wenjian Yu, Tsinghua University

 

Industrial Session Chair:

Fan Yang , Shenzhen GWX Technology Co.,Ltd.

 

Tutorial/Training Chair:

Zuochang Ye, Tsinghua University

 

Finance Chair: 

Gang Chen, Nanjing Industrial Innovation Center of EDA

 

Keynote Speaker Chair:

Wanli Chang, University of York

 

Panel Chair:

Yibo Lin, Peking University

 

Local Arrangements Chair:

Xiaoning He, Shaanxi Province Semiconductor Association

 

Session Chair:

Cheng Zhuo, Zhejiang University

 

Publication Chair:

Qiang Xu, The Chinese University of Hong Kong

 

Industry Liaison:

Yutao Ma, Primarius Technologies Co.,Ltd

 

Exhibition Chair:

Megy Wang, Giga Design Automation Limited

 

Publicity Chair:

Xin Li, Duke Kunshan University

 

Outreach Chair – US:

Hai Zhou, Northwestern University

 

Outreach Chair – Canada;

Peter Chun, University of Alberta

 

Outreach Chair – Europe:

Zebo Peng, Linköping University

 

Outreach Chair – Asia;

Xiaoqing Wen, Kyushu Institute of Technology

 

★Track Committee

 

1. Technology & Model

Chair: 

Xingsheng Wang, Huazhong University of Science and Technology

Co-Chair: 

Lining Zhang, Peking University

 

2. Analog Circuit

Chair:

Fan Yang, Fudan University

Co-Chair:

Hao Yu, Southern University of Science and Technology

 

3. Digital Design & Verification

Chair: Zhufei Chu, Ningbo University

Co-Chair: Yong Fu, XEPIC Corporation Limited

 

4. Physical Implementation

Chair: Hailong Yao, University of Science and Technology Beijing

Co-Chair: Peng Cao, Southeast University

 

5. Wafer Manufacturing

Chair: Lan Chen, Institute of Microelectronics of The CAS

Co-Chair: Yayi Wei, Institute of Microelectronics of The CAS

 

6. Packaging & Multi-Physics

Chair: Hongliang Lu, Xidian University

Co-Chair: Min Tang, Shanghai Jiao Tong University

 

7.Emerging Technology

Chair: Bei Yu, The Chinese University of Hong Kong

Co-Chair: Li Jiang, Shanghai Jiao Tong University

 

8. EDA Foundation & Standards

Chair: Xiaohui Tan, Nanjing Industrial Innovation Center of EDA

Co-Chair: Duanduan Jian, China Electronics Standardization Institute

 

8. Open Source EDA

Chair: Huawei Li, Institute of Computing Technology, CAS

Co-chair: Guojie Luo, Peking University

 

8. EDA Contest

Chair:  Longxing Shi, Southeast University

Co-Chair: Zhixiong Di, Southwest Jiaotong University

 

★Call for Papers

 

Original papers in, but not limited to, the following areas are invited:

[1] Technology & Model

1.1 Device Compact Modeling

1.2 Process Design Kit

1.3 Semiconductor Process & Device Simulation

1.4 Cell Library Design, Characterization and Verification

 

[2]Analog Circuit

2.1 Schematic & Layout Design

2.2 Circuit Simulation

2.3 On-chip & Packaging Electromagnetic Field Simulation

2.4 Radio-Frequency & Photoelectric Compound Circuit Simulation

 

[3]Digital Design & Verification

3.1 Digital Simulation / Emulation

3.2 High-Level Synthesis

3.3 Logic Synthesis 

3.4 Formal Verification

3.5 Constructing Hardware in Scala Embedded Language

 

[4]Physical Implementation

4.1 Design-For-Test, Design-For-Reliability, Design-For-Manufacturability

4.2 Placement & Routing

4.3 Parasitic Extraction

4.4 Timing Analysis

4.5 Physical Verification

4.6 Electromigration & IR drop

 

[5]Wafer Manufacturing

5.1 Computational Lithography

5.2 Masking Manufacturing

5.3 Yield & Defect Analysis

5.4 Process Modeling and Emulation

5.5 Metrology and Silicon Data Processing

5.6 APC (Automatic Process Control) Technology

 

[6]Packaging & Multi-Physics

6.1 Packaging Design

6.2 Chip Level Thermal Simulation

6.3 Packaging Stress Analysis

6.4 Multi-Physics Simulation

 

[7]Emerging Technologies

7.1 Artificial Intelligence for EDA

7.2 Cloud / Parallel Computing for EDA

7.3 Heterogeneous Computing for EDA

 

[8]Miscellaneous

8.1 Open Source EDA

8.2 EDA Database

8.3 EDA Standardization

 

 

★Keynote Speaker

 

1. Jamal Deen, Professor at McMaster University; Senior Canada Research Chair in Information Technology; Director, Micro- and Nano-Systems Laboratory (MNSL); President, Academy of Science, Royal Society of Canada (2015-17); FRSC Fellow, Royal Society of Canada; A-CAS Academician (Foreign Member), Chinese Academy of Sciences.

 

2. David Atienza Alonso, Professor of Electrical and Computer Engineering; Head of the Embedded Systems Laboratory (ESL) and Scientific Director of the EcoCloud Sustainable Computing Center at EPFL

 

3. Mehdi B. Tahoori, Professor at KIT (Karlsruhe Institute of Technology); Chair of Dependable Nano-Computing (CDNC) at the Institute of Computer Science & Engineering (ITEC)

 

4. Prabhat Mishra, Professor at University of Florida; IEEE Fellow; AAAS Fellow

 

5. John Kim, Professor at KAIST (Korea AdvancedInstitute of Science and Technology)

 

More speakers will be updated soon...

 

 

 

Authors are invited to submit original papers, which have not been published elsewhere and are not currently under consideration for another journal, conference or workshop. Research findings can be submitted as full papers. All paper submissions must be done electronically using the submission system.

 

Best Paper Award, Honorable Mention Paper Award will be selected after the presentations.

Invited Talks: Need an abstract within one page

Extended Abstract: 1-2 pages

Regular Paper: 4-6 pages

Note: Extended abstract will not be published. If you have the publication purpose, please submit full paper before the deadline.

 

★Paper Template

Templates could be downloaded from below or you can find them at the IEEE website: https://www.ieee.org/conferences/publishing/templates.html

 

★Submission Link: https://www.eda2.com/conferenceHome/submissionHome

 

 

★Liaison

IEEE/CEDA Representative: Tsung-Yi Ho

CIE Representative: Shouyi Yin

Website Chair: Huixin Tang

Secretary: Xiakai Wang

 

★Contact Us

Conference Secretary: Ms. Joyce Zhong

Phone: +86 186 2826 3876

Email: [email protected]

Yu Huang | [email protected]