Promoter
NameICICM
Emailicicm@young.ac.cn
Websitewww.icicm.net
Description
Contact Person : Ms Sissi Chan ; Last Date for the submission of abstract : 30/09/2018; The previous 2 editions ICICM were sponsored by IEEE and it has been successfully held in Chengdu on November 23-25, 2016 and Nanjing on November 8-11, 2017. The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018) will be held on November 24-26, 2018 in Shanghai, China with the support from University of Electronic Science and Technology of China and Southeast University, China.
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