2024 the 7th International Conference on Smart Materials Applications (ICSMA 2024) will take place in Singapore during January 14-16, 2024.The conference program covered invited, oral and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas with the aim of developing new projects and exploiting new technology in this field.

Conference Proceedings:

All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, which is indexed by Scopus.

Call for Papers:

Topics of interest for submission include, but are not limited to:Materials Science and Engineering,Materials Properties, Measuring Methods and Applications,Methodology of Research and Analysis and Modeling,Materials Manufacturing and Processing. More information plz visit http://www.icsma.org/ 

Submission Link:

http://confsys.iconf.org/submission/icsma2024

Page Requirements:

Each paper should have no less than 5 pages normally, including all figures, tables, and references. 

One regular registration is within 5 Pages. Extra pages will be charged.  

For any inquiry about the conference, please feel free to contact:

Ms. Loey Liu

Conference Secretary of ICSMA 

Email: [email protected]

Tel: +852-30717761 (Hong Kong) / +86-18062000004 (China)

(Office Time 9:30 - 18:00, Time zone: GMT+8; Monday to Friday) 

Website: http://www.icsma.org/