Full Name: 2023 3rd IEEE International Conference on Software Engineering and Artificial Intelligence (SEAI 2023)

Xiamen, China

June 16-18, 2023

www.seai.org

Publication:

All registered and presented papers will be published in Conference Proceedings, which will be submitted to Ei Compendex and Scopus. 

Call for Paper:

Artificial Intelligence & Applications

AI Algorithms

Knowledge-based Systems

CAD Design & Testing

Software Engineering Techniques and Production Perspectives

Requirements Engineering 

Software Analysis, Design and Modeling

Software Maintenance and Evolution

Multimedia and Hypermedia Software Engineering

Software Engineering Methodologies

Agent-based Software Engineering

Software & System Quality of Service

Soft Computing

Software and System Testing Methods

Software & System Security

Software and System Security and Privacy

Mobile APP Security and Privacy

Encryption Methods and Tools

Security Service Systems

More topics via: http://www.seai.org/topic.html

Venue: Pan Pacific Xiamen

Address: 19 Hubin Bei Road, Xiamen, Fujian, China 361012

Submission Methods:

Full Paper (publication and oral presentation)

Abstract (oral presentation only)

Electronic Submission System (.pdf)  

http://confsys.iconf.org/submission/seai2023

or submit it via email: seai_conf@163.com.

Contact Us:

Ms. Ching Cao

E-mail: seai_conf@163.com