Time: February 25-27, 2022

Place: Shanghai, China

Website: http://iccbn.org/

◥ Proceedings

Accepted (Registered and Presented) papers will be published in the International Conference Proceedings by ACM (ISBN: 978-1-4503-8743-9) and indexed by Ei Compendex and Scopus, etc.

◥ History

* ICCBN2021 | 25-27 February 2021 | Virtual 

ICCBN 2020 proceedings were archived in ACM Digital Library (ISBN: 978-1-4503-8917-4), and indexed by Ei Compendex & Scopus.

* ICCBN 2020 | 15-18 April 2020 | Auckland University of Technology, Auckland, New Zealand

ICCBN 2020 proceedings were archived in ACM Digital Library (ISBN: 978-1-4503-7504-7), and indexed by Ei Compendex & Scopus.

* ICCBN 2019 | 12-15 April 2019 | Nagoya Institute of Technology, Japan

ICCBN 2019 proceedings were archived in ACM Digital Library (ISBN: 978-1-4503-6247-4), and indexed by Ei Compendex & Scopus.

* ICCBN 2018 | 24-26 February 2018 | Singapore

ICCBN 2018 proceedings were included in ACM Digital Library (ISBN: 978-1-4503-6360-0), and indexed by Ei Compendex & Scopus.

* ICCBN 2017 | 20-22 February 2018 | Bali, Indonesia

ICCBN 2017 proceedings were included in ACM Digital Library (ISBN: 978-1-4503-4861-4), and indexed by Ei Compendex & Scopus.

◥ Committees

Conference Chairs

Jie Li, Shanghai Jiao Tong University, China

Maode Ma, Nanyang Technological University, Singapore

Moshe Zukerman, City University of Hong Kong （IEEE Fellow)

Program Chair

Edmund Lai, Auckland University of Technology, New Zealand

Thanh Van Do, Telenor / Oslo Metropolitan University, Norway

International Publicity Committee

Dan Michael A. Cortez, Technological Institute of the Philippines-Quezon City Campus, Philippines

Syed Faraz Hasan,Massey University，New Zealand

Stavros Shiaeles, Plymouth University, United Kimdom

Technical Program Committee

Azuan Ahmad, Universiti Sains Islam Malaysia, Malaysia 

Anthony Brown, The University of Manchester, UK

Xiangning Chen, NanJing University, China

Yongqiang Cheng, The University of Hull, United Kimdom

Hosam El-Ocla, Lakehead University, Canada (IEEE Senior Member)

Hongyuan Gao, Harbin Engineering University, China(IEEE Member)

Fu Hongyan, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, China (IEEE Member)

Benchaphon Limthanmaphon,King Mongkut's University of Technology North Bangkok, Thailand

Malissa Maria Mahmud, Sunway University, Malaysia 

Yusnita Rahayu, University of Riau, Indonesia(IEEE Senior Member)

Madihah Mohd Saudi, Universiti Sains Islam Malaysia, Malaysia

Hui-Kai Su, National Formosa University, Taiwan. (IEEE Member)

Muhammad Suryanegara, Universitas Indonesia, Indonesia

June Tay, Singapore University of Social Sciences, Singapore

Takeshi Tsuchiya, Suwa University of Science, Japan(IEEE Member)

Liwei Yang, China Agricultural University, China

★Submission

1. Full paper (publication and presentation)

Full paper with at least 8-10 pages is requested by following the template.

2. Abstract (only presentation)

If you just want to make an oral presentation without paper publication, then you can only submit an abstract within 300-500 words.

Submission Online System：

For submission, please upload it to the Submission System (.pdf): http://confsys.iconf.org/submission/iccbn2022

If you have any difficulties, please directly email your paper to [email protected]

◥ Contact Us

Louie Wang

Email: [email protected]

Tel: 132-9869-9999