TECHSPO Dubai – Where Business, Tech and Innovation Collide in Dubai, UAE   TECHSPO Dubai Technology Expo returns September 22-23, 2026 to the Sofitel Dubai Jumeirah Beach Hotel in Dubai, United Arab Emirates. This must-attend, two-day annual event brings together leading developers, marketers, inno…

TECHSPO Singapore – Where Business, Tech and Innovation Collide in Singapore!   TECHSPO Singapore Technology Expo returns August 26-27, 2026 to the Four Points by Sheraton Singapore Riverview Hotel in Singapore. This must-attend, two-day annual event brings together leading developers, marketers, in…

2026 International Conference on Electronics, Communications and Computer Science (ICECCS 2026)-IEEE Location: Chengdu, China Dates: July 10-12, 2026 Website: http://www.iceccs-conf.net/ E-mail: sub_iceccs@163.com Conference Format: Online and In-person   2026 International Conference on Ele…

2025 2nd IEEE Asia Conference on Advances in Electrical and Power Engineering (ACEPE 2025) Location: Shanghai, China Dates: December 12-14, 2025 Website: http://www.acepe.net/ E-mail: acepe_conf@163.com Conference Format: Online and Onsite   2025 2nd Asia Conference on Advances in Electrical…

2025 5th International Conference on Information Technology and Natural Language Processing (ITNLP 2025) Location: Guangzhou, China Dates: August 22-24, 2025 Website: http://www.itnlp.net/ E-mail: submit@itnlp.net Conference Format: Online and In-person   2025 5th International Conference on …

【Full name】The 2025 International Conference on Computer Vision, Pattern Recognition and Detection (ICVPRD 2025)   【About ICVPRD 2025】The 2025 International Conference on Computer Vision, Pattern Recognition and Detection will be held on October 25-26, 2025 in Chongqing, China. ICVPRD 2025 is techni…

  Corvus Global Events invites you to Pharma Supply  Chain & Security World 2020 - Supply-chain, Drug Serialization And Anti-Counterfeiting conference, which will have Pharma industry experts sharing various challenges faced, new strategies, case studies and use of innovative ideas, the confere…

WELCOME REMARK The organizing committee sincerely welcome you to join in the Symposium on World Cell and Molecular Biology (CMB2023), which will be held during May 26-28, 2023 in Singapore. CMB 2023 includes plenary forum, 13 breakout streams, as well as poster exhibition in the three-day scientif…

关于 ICMMPM 2026： 第八届国际金属材料工艺与制造大会（ICMMPM 2026）是全球冶金和制造领域首屈一指的年度盛会，汇聚了来自世界各地的顶尖研究人员、工程师和行业专家。本届大会将于2026年11月16日至18日在韩国首 尔举行，将聚焦金属材料开发领域的新兴技术和可持续解决方案。     会议主题： 欢迎提交完整的科研报告和进行中的工作报告。ICMMPM 2026将设有口头报告和海报展示环节。    征稿主题包括但不限于： T1：金属合金材料 T2：新型材料和性能 T3：冶金基础与技术 T4：制造工程 您可以在以下网址找到更多相关主题：https://icmmp…

Contact Person : Prof M Subhan Qureshi; Last Date for the submission of abstract : Not Available ; Description : Theme: Developing a hub of dairy enterprises in the flood affected regions of Khyber Pukhtunkhwa through partnership of academia, government, entrepreneurs & civil society.

Contact Person : Chairman, IIT Kanpur; Last Date for the submission of abstract : 22/07/2011; Description : The XVI International Workshop on the Physics of Semiconductor Devices is being organized at Kanpur by the Indian Institute of Technology-Kanpur and Semiconductor Society of India dur…

Contact Person : Nimrita; Last Date for the submission of abstract : 40454; Description : This seminar is an endeavour to bring to a common platform eminent speakers and researchers to share expertise and knowledge about the most urgent need of the networked world-Security.

Contact Person : Louise Slade; Last Date for the submission of abstract : Not Available ; Description : This year's event has been researched and developed to help you tackle the grey areas of project management and teamwork within medical device R&D;, design and product development.

Contact Person : Prof. Lubna Shaikh; Last Date for the submission of abstract : 41030; Description : The conference aims to provide a forum for the exchange of ideas on the latest business innovation developments in the field of management, engineering and technology among researchers an…